An innovative Inter-Die Gapfill Tool has been introduced by Lam Research Corp. in Fremont, California on September 9, 2025. Known as VECTOR® TEOS 3D, this tool expands the company's range of solutions for 3D Integration and Chiplet Technologies, setting the stage for cutting-edge AI-enhanced architectures. Lam Research Corp., listed on Nasdaq as LRCX, is at the forefront of this development.